Qualcomm Snapdragon SiP 1 is the first SiP chipset from Qualcomm. The company and the Shanghai-based Universal Scientific Industry in Brazil, in a joint venture produced a new chip called Snapdragon SiP instead of SoC in early 2019, which stands for “System in Package”.
Unlike other chipsets, the Snapdragon SiP chip is smaller and powerful at the same time. Qualcomm has tried to further reduce the size of the SoCs with the Snapdragon SiP 1. Compared to a System-on-Chip (SoC), an SiP System-in-Package chipset offers more space on the circuit board, thereby liberating more space for manufacturers to fit in more components.
The new system-in-package processor integrates various components of the same Snapdragon SoC with newer parts like application processor, power management, RF front end, and audio codec. The chip actually focuses on delivering the same performance as it’s other chips, but in a more simplified manner.
The size is going to be much smaller, and Qualcomm aims to take the manufacturing process to the next level by helping chip manufacturers to make chips faster and in a more convenient way. The Snapdragon SiP1 when compared, offers similar performance to a Snapdragon 450 SoC.
h2> Process Technology (nm)
The chip is built on a 14nm manufacturing node process, and like other 14nm nodes it should provide faster speed and less but efficient power consumption.
Snapdragon SiP 1 Processor
It integrates 8 powerful processor cores which are clocked up to 1.8GHz for handling a range of high demanding applications and less performing ones. In the Qualcomm’s portfolio, two chipsets fit this description which are Snapdragon 632 and Snapdragon 450.
Snapdragon SiP 1 Graphics
The chip is powered with an Adreno 506 GPU, which is clocked at 650 MHz, and according to Qualcomm, it has PC-class graphics. It supports the OpenGL ES 3.1+ API as well as a Full HD 1080p display, that means gaming experience is enjoyable due to its great display resolution.
Over at AnTuTu, specifically on the version 6, the chip reaches a low of 134012, avg of 140206, median of 141971 and max points of 142870.
Qualcomm Snapdragon SiP 1 Phones
The chip was launched in Brazil, both the new Asus Zenfone smartphones are the world’s first smartphones to pack in Qualcomm’s latest Snapdragon System in Package (SiP).
Qualcomm Snapdragon SiP 1 Full Specifications
|Number Of Cores||8-Cores|
|GPU (Graphics)||Adreno 506|
==> Disclaimer: Specifications, features shown for this chipset was inserted manually. We cannot guarantee that the info on this page is 100% correct. If you think that any information of this particular chipset is wrong or missing, please don’t hesitate to Contact Us.
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