HiSilicon Kirin 970 is a high-end ARM based octa-core System on a chip for smartphones and tablet, which was introduced alongside the Huawei Mate 10 in late 2017. Huawei’s semiconductor division, HiSilicon, has over the last several years been the one company which seems to have managed what the others haven’t had a fair share of: the high-end market with solutions that are competitive with Qualcomm being the current leader in the moblie processor manufacturing.
The Kirin 970 is actually the first to involve a dual-card dual-4G dual-VoLTE technology into commercial use. This feature enables both the primary SIM card and the secondary SIM card on smartphones to support 4G VoLTE calls and provide the same HD voice calls and video calls.
The Kirin 970 is engineered on the most advanced TSMC’s 10nm process technology, which is known to harness up to 5.5 billion transistors in an area roughly the size of a fingernail. According to it’s manufacturer, Smartphone chipsets need to deliver the best possible performance, while ensuring the highest possible performance and energy efficiency under low heat. This imposes ultra-high requirements on chip design.
HiSilicon Kirin 970 Processor
The chip has 8 CPU cores of 4 performance Cortex-A73 cores and 4 energy efficient Cortex-A53 cores. The Kirin 970 delivers about 25% increase the performance of four Cortex-A73 cores with 50% greater energy efficiency.
The performance cores is clocked at up to 2.4 GHz and the four A53 energy saving cores clocked up to 1.8 GHz. There should be improved performance by about 20%, according to Huawei, while the power consumption should be reduced by 20%. It was highly compared to the Snapdragon 845.
HiSilicon Kirin 970 Graphics
The 970 chip is also equipped with a modern Mali-G72 MP12 graphics adapter and a dual-channel LPDDR4 memory controller.
The ARM Mali-G72 MP12 is an integrated high-end graphics card for ARM based chips (mostly Android based). It was introduced in October 2017 in the Huawei Mate 10 and uses 12 clusters (hence the MP12 name). In benchmark tests, the chip performs between the Adreno 530 and 540 and is therefore suitable for more demanding mobile games.
It has improved capabilities in image recognition, voice interaction, and intelligent photography, smartphones powered by the Kirin 970 can better understand the user’s every need. With the release of this chipset, Huawei aims to enable broader use of AI technology in the application field and provide consumers with a never-before-seen AI experience right in the palm of their hands.
They designed a new HiAI mobile computing architecture to integrate a dedicated neural-network processing unit (NPU) which delivers an AI performance density that far surpasses any CPU and GPU. Simply put, the Kirin 970 can perform the same AI computing tasks faster and while consuming much lower energy.
The Kirin 970 has optimized the entire photographing process in depth, including the response time, focus, motion detection, exposure policy, and more. The response time and processing time have been reduced by 30%.
To cope with the challenges of complex frequency bands around the world, the Kirin 970 has made upgrades in the communication field and has also adopted advanced technologies such as a 4×4 MIMO, 5CC CA, and 256-QAM to aggregate breaking frequency spectrums into the maximum bandwidth.
At aggregate, the peak capability of the Kirin 970 supports a download rate of up to 1.2Gbps, achieving a very high connection speed of mobile Internet.
Over at AnTuTu, specifically on the version 6, the chip reaches a low of 173653, avg of 177915, median of 178490 and max points of 181973.
HiSilicon Kirin 970 Phones
HiSilicon Kirin 970 Full Specifications
|Number Of Cores||8-Cores|
|GPU (Graphics)||ARM Mali-G72 MP12|
==> Disclaimer: Specifications, features shown for this chipset was inserted manually. We cannot guarantee that the info on this page is 100% correct. If you think that any information of this particular chipset is wrong or missing, please don’t hesitate to Contact Us.
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